发明名称 METHOD FOR BONDING STUD PIN OF GLASS PANEL FOR CATHODE RAY TUBE
摘要 PURPOSE: A method for bonding a stud pin of a glass panel for a cathode ray tube is provided to bond a stud pin by using an electrostatic bonding method at a skirt portion of a glass panel for a cathode ray tube, thereby simplifying process and equipment and enhancing the productivity. CONSTITUTION: In a method for bonding a stud pin(2) at a skirt portion of a glass panel(3) for a cathode ray tube, the glass panel(3) contains at least alkaline ingredient of 14 percents and the stud pin(2) is bonded on the glass panel(3) by an electrostatic bonding method. When the stud pin(2) is bonded on the glass panel(3), a temperature ranging from 200 to 600°C is used. When the stud pin(2) is bonded on the glass panel(3), the direct current voltage(1) ranging from 500 to 3000 volts is used or the direct current voltage(1) ranging from 700 to 2000 volts is used. Under 500 volts, the bonding is not sufficient or it takes much time to bond. Over 3000 volts, the glass panel(3) has the high possibility of insulation breakdown thereon.
申请公布号 KR20000075339(A) 申请公布日期 2000.12.15
申请号 KR19990019879 申请日期 1999.05.31
申请人 SAMSUNG CORNING CO., LTD. 发明人 HONG, BYEONG SEON
分类号 H01J9/24;(IPC1-7):H01J9/24 主分类号 H01J9/24
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