| 摘要 |
PROBLEM TO BE SOLVED: To provide a wire bonding method in which a semiconductor chip is tightly held on a heater plate, especially at wire bonding work where an external lead wire is jointed to a semiconductor chip. SOLUTION: In ultrasonic wire bonding, in which an external lead wire is joined to a semiconductor chip 3, a recessed part 8 whose area is smaller than that of a mounting area for the semiconductor chip is formed on a heater plate 1 on which the semiconductor chip 3 is mounted, and a vacuum hole 7 is made to communicate with the recessed part, and the semiconductor chip mounted on the heater plate is held by negative pressure acting on the recessed part. |
