ELECTROSTATIC CHUCK FOR HEATING AND HOLDING WAFER

摘要

PROBLEM TO BE SOLVED: To provide a light-weight and compact electrostatic chuck for heating and holding a wafer flat, which provides a high (electrostatic) chucking force for holding an electrostatic wafer flat, facilitates it control, can adequately attain heating of the wafer without nonuniformity of temp. and is superior in wafer-chucking performance and heat controllability. SOLUTION: A wafer plate comprises a dipole-type electrostatic chuck for holding a wafer flat and a heater for heating the wafer, using an a.c. power source, and the electrostatic chuck has dipole electrodes 3, 4, one or both of which serve also as a heating element for the heater.