| 摘要 |
PROBLEM TO BE SOLVED: To manufacture a package with electrodes exposed at the bottom at a low cost, without etching, by using a stripping method as a means for removing a substrate from a resin package, rather than an etching method. SOLUTION: After forming a package 10, a metal film 14 and a lead frame 13 are removed from the package 10, and the metal film 14 is stripped off the package, together with the lead frame 13. The metal film 14 is adhered strongly to the lead frame 13 which can be stripped off the package by strongly pulling the film 14 in the opposite direction from the package 10. Thus when the metal film 14 is stripped off the package 10, bond faces 18a of bump electrodes 18 remain exposed at the bottom 10a of the package, thereby forming mounting bump electrodes thereon.
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