| 摘要 |
<p>PROBLEM TO BE SOLVED: To increase thermal conductivity of a face plate in the temperature- adjusting device of a silicon wafer, and to make the surface temperature uniform through reduction in elevation temperature time and reduction of temperature distribution. SOLUTION: In a heat conduction plate, that is used as the face plate of a temperature-adjusting device for heating or cooling a silicon wafer to a specific temperature, a reinforcing material 11 is cast inside a copper plate 10. The reinforcing material 11 is formed of a material with bending strength which is larger than copper, and many clearances 12a for mutually connecting the copper materials of front and back surfaces are provided inside.</p> |
