| 摘要 |
PROBLEM TO BE SOLVED: To greatly improve productivity of semiconductor package assembling step by simultaneously conducting assembling of a number of printed circuit board units for every unit process and to remove an excessive hardened resin sealing material on a mode runner gate and on a mold runner between gates, without the possibility of damaging the surface of the printed circuit board. SOLUTION: This printed circuit board is comprised of a number of printed circuit board units 100a in at least two rows, and the first mold runner gate 1a of the printed circuit board unit on the first row is connected with the second mold runner gate 1b of the printed circuit board unit on the second row by means of a mold runner 20 between the gates. In addition, the inside wall on the second mold runner gate is provided with a plated through-hole 12a and/or a dummy trace 16 for removing resin formed on the mold runner between the gates. |
