| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a method for manufacturing a module that has a chip mounted on a carrier board, with the use of a guide board which can be penetrated by ablation radiation. SOLUTION: A removable layer 37 is provided on a surface of a guide board 35. A first alignment guide 36 is formed on the removable layer, and a second alignment guide 21 is formed on the front side surface of a chip 30. By bringing the second alignment guide 21 into contact with the first alignment guide, the chip is aligned with the guide board. Then the chip 30 is mounted on the guide board 35. A carrier board 52 is mounted on a rear side surface of the chip. Then, using radiation which penetrates the guide board (generally laser radiation), an interface between the removable layer 37 and the guide board 35 is melted and removed, so that the guide board 35 is cut off. Then a thin film provided with metallic interconnection is provided on the front side surface of the chip.</p> |
