| 摘要 |
PROBLEM TO BE SOLVED: To provide a positioning mechanism with a temporary loading table and polishing device by which both semiconductor wafers subject to pre- processing and post-processing in two reverse directions can be handled smoothly and simultaneously. SOLUTION: This alignment mechanism pushes up a semiconductor wafer which is placed on a supporting member 55, from the supporting member 55 by using an alignment member 58, and rotates it so as to align the reference position of a notch or the like of the semiconductor wafer at a desired position. A temporary loading table 59 on which the semiconductor wafer is placed separately is installed under a part placing and aligning the semiconductor wafer. |
