发明名称 SUBSTRATE TREATMENT METHOD AND ITS DEVICE
摘要 PROBLEM TO BE SOLVED: To provide a substrate treatment method and device for reducing the load of a heating means, and for preventing the generation of bacteria in processing solution. SOLUTION: Pure water in a pure water storage tank 80 is heated to a prescribed temperature, and this pure water and chemicals is packed in a cleaning bath 60, and a wafer W is immersed so that the wafer W can be cleaned in chemicals. In this case, the pure water is supplied and stored in the pure water storage tank 80 while the heating of the pure water is stopped, and the pure water at a small flow rate is continuously supplied, and the pure water is discharged from the pure water storage tank 80 through an overflow tube 82, and the pure water stored in the pure water storage tank 80 is allowed to flow at all times. The supply and discharge of the pure water is stopped a prescribed time, before a time to start the packing in the cleaning bath 60, and a cartridge heater 95 is operated.
申请公布号 JP2000294532(A) 申请公布日期 2000.10.20
申请号 JP19990095046 申请日期 1999.04.01
申请人 TOKYO ELECTRON LTD 发明人 YAMAGUCHI TOKUHIRO;TAKASHIMA TOSHIHIDE
分类号 B08B3/08;B08B3/10;H01L21/304;H01L21/306;(IPC1-7):H01L21/304 主分类号 B08B3/08
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