| 摘要 |
PROBLEM TO BE SOLVED: To precisely position a circuit body even if the circuit body is distorted due to difference of coefficients of thermal shrinkage of resin material and the circuit body at the time of molding resin. SOLUTION: In the method for producing the integrally molded circuit body, the integrally molded circuit body is obtained by setting a circuit body 30 in molding dies 31, 32 and casting resin material 36. Tension is applied on the circuit body 30 at the time of casting the resin material and cooling. The circuit body 30 is engaged with a movable supporting tool 34 and tension is applied by moving the movable supporting tool 34 by pressure at the time of casting resin material 36. The circuit body is pinched by a fixing jig with force weaker than the tension in the inside of the molding die and the circuit body 30 is supported by a supporting projection part in the inside of the molding die. The resin body is formed by the resin material 36 and also the terminal of the circuit body 30 is projected from the resin body and a connector housing is integrally formed together with the resin body around a terminal.
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