| 摘要 |
PROBLEM TO BE SOLVED: To provide a tape with an adhesive for a semiconductor device having excellent high lifetime and high adhesive properties and a substrate for connecting a semiconductor using the tape and the semiconductor device. SOLUTION: In the tape with the adhesive for the TAB having a protective film layer and an adhesive layer on an organic insulating film having flexibility, total calorific values are kept within the ranges of 0.5<=QB(500)/QB(0)<=1 and 0<=QC(0)/QB(0)<=0.4, when the adhesive layer contains a thermosetting resin, total calorific values before the curing by heating and after the curing by heating of an adhesive composition under an initial state are represented by QB(0) and QC(0) respectively, and total calorific values before the curing by heating of the adhesive composition after conservation for 500 h at 60 deg.C are represented by QB(500). |
