Verwendung von präkeramischen Polymeren als Klebstoffe für Elektronik

摘要

A method of adhering an electronic component to a substrate in which a layer of a preceramic polymer is applied between the electronic component and the substrate to which it is to be adhered followed by heating to convert the preceramic polymer into a ceramic. The method forms a strong bond which is not affected by the environment. The method is valuable for adhering integrated circuit chips to carriers or circuit boards.