| 摘要 |
<p>A method of producing printed wiring boards capable of relatively simply forming a filled via on a buildup layer without involving high cost. The method of producing printed wiring boards that forms a filled via (9) on an insulation layer (5) constituting a buildup layer by plating, wherein after the insulation layer (5) of predetermined thickness is formed with a via forming hole (10) of small diameter, the whole of the insulation layer is formed with a primary layer of plating using an electroless plating bath, and then electrolytic panel plating is applied to the primary layer of plating using an electroplating bath having added thereto an additive agent having a leveling action, thereby filling the via forming hole and forming on the insulation layer (5) a film of electrolytic panel plating having an approximately flat surface.</p> |
