发明名称 |
Thermoplastic resin composition and heat-resistant tray for IC |
摘要 |
A thermoplastic resin composition in which 5 to 45 parts by weight of carbon fiber and 0.1 to 10 parts by weight of conductive carbon black are compounded per 100 parts by weight of resin components comprising an aromatic polycarbonate resin and an aromatic polysulfone resin. The thermoplastic resin composition is excellent in heat-resistance and mechanical strength, and heat-resistant IC trays therefrom are useful products which can endure drying of IC at high temperature and are excellent in handling properties.
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申请公布号 |
US6127492(A) |
申请公布日期 |
2000.10.03 |
申请号 |
US19990309256 |
申请日期 |
1999.05.11 |
申请人 |
SUMITOMO CHEMICAL COMPANY, LIMITED |
发明人 |
NAGASHIMA, TOHRU;MAEDA, MITUO;NAKAMURA, HIROSHI |
分类号 |
C08K3/04;C08K7/06;C08L69/00;C08L81/06;(IPC1-7):C08F283/02 |
主分类号 |
C08K3/04 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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