发明名称 |
Method of manufacturing a semiconductor device having nitrogen-bearing oxide gate insulating layer |
摘要 |
A semiconductor device having a nitrogen-bearing oxide gate insulating layer and methods of manufacture thereof are disclosed. A semiconductor device is formed by selecting a nitrogen-bearing species capable of providing a desired depth-distribution of nitrogen when an oxide layer is formed using the nitrogen-bearing species. The oxide layer is formed over a substrate, the oxide layer having the desired depth-distribution of nitrogen. A part of the oxide layer is selectively removed, giving the oxide layer a resultant depth-distribution of nitrogen. In accordance with another aspect of the process, a semiconductor device is formed by forming, in a reaction chamber, an oxide layer including nitrogen-bearing species on a substrate. A part of the oxide layer is selectively removed in the same reaction chamber.
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申请公布号 |
US6127284(A) |
申请公布日期 |
2000.10.03 |
申请号 |
US19970993416 |
申请日期 |
1997.12.18 |
申请人 |
ADVANCED MICRO DEVICES, INC. |
发明人 |
GARDNER, MARK I;GILMER, MARK C. |
分类号 |
H01L21/28;H01L29/51;(IPC1-7):H01L21/469 |
主分类号 |
H01L21/28 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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