| 摘要 |
PROBLEM TO BE SOLVED: To obtain a structure which more surely prevents a malfunction due to photoirradiation of electronic parts than in the conventional one in an electrooptical device having electronic parts mounted on a substrate. SOLUTION: A light shielding layer 136 which is formed by a printing, a photolithography method or the like is formed on a surface of a protruding region 11a. A wiring pattern 131, an anisotropic conductive film 132, a panel terminal part 134 or the like are formed on the light shielding layer 136. The light shielding layer 136 is constructed so as to shield at least a part of a light component electronically affecting at least an active layer formed on the lower side of an integrated circuit chip 133, especially light emitted from the inside of a substrate 11 toward the integrated circuit chip 133. |
