发明名称 METHOD FOR TREATING SURFACE UTILIZING HIGH FREQUENCY GLOW DISCHARGE
摘要 PROBLEM TO BE SOLVED: To suppress the generation of a standing wave and to enhance discharge stability, surface treatment uniformity and surface treatment rate in a method for treating surface utilizing high frequency glow discharge. SOLUTION: This method for treating surface utilizing high frequency glow discharge conducts the treatment of a substrate surface whereby a high frequency electric power is introduced from a high frequency power source 4 to a device provided with a high frequency electrode 1 and a substrate electrode 2 in a reaction chamber 3, and a plasma 10 is generated by glow discharge excited by a high frequency voltage applied on the high frequency electrode 1. In the method, the surface is treated such that the maximum dimensions of the surface of each divided conductor part 101 of the high frequency electrode 1, the surface is facing to the plasma generating space, are smaller than a value C/4f, a quarter of light velocity C in vacuum is divided by the frequency (f) of a high frequency applying voltage.
申请公布号 JP2000268994(A) 申请公布日期 2000.09.29
申请号 JP19990069684 申请日期 1999.03.16
申请人 FUJI ELECTRIC CO LTD 发明人 SASAKI TOSHIAKI
分类号 H01L21/302;C23C14/40;C23C16/50;C23C16/505;C23C16/515;H01L21/205;H01L21/3065;H05H1/24;H05H1/46 主分类号 H01L21/302
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