发明名称 SOLUTION FOR COATING NON CONDUCTORS WITH CONDUCTIVE POLYMERS AND THEIR METALLIZATION PROCESS
摘要 <p>PCT No. PCT/DE93/00789 Sec. 371 Date Apr. 11, 1995 Sec. 102(e) Date Apr. 11, 1995 PCT Filed Aug. 20, 1993 PCT Pub. No. WO94/04591 PCT Pub. Date Mar. 3, 1994A process for metallizing non-conductive surfaces, by treating the non-conductive surface with a solution containing at least one suspended or solute oxidation agent, contacting the treated non-conductive surface with an acidic solution containing at least one water soluble polymer selected from the group consisting of homopolymers and copolymers, and at least one aromatic compound which chemically polymerizes the water-soluble polymer and the aromatic compound to form a conductive polymer, and electroplating the conductive polymer. Each water-soluble polymer contains uncharged structural elements or is cationic polyelectrolyte. Additionally, each water soluble polymer is capable of protonizing/deprotonizing reactions, formation of hydrogen bridge compounds and van der Waals interactions.</p>
申请公布号 EP0656025(B2) 申请公布日期 2000.09.27
申请号 EP19930918920 申请日期 1993.08.20
申请人 ATOTECH DEUTSCHLAND GMBH 发明人 RAGGE, ANDREA;MEYER, HEINRICH;URRUTIA DESMAISON, GONZALO
分类号 C08K5/00;C08G61/12;C08G73/02;C08L101/00;C08L101/14;C09D201/00;C25D5/54;H01B1/12;H01B5/16;H01B13/00;H05K3/42;(IPC1-7):C08G61/12 主分类号 C08K5/00
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