| 摘要 |
<p>PROBLEM TO BE SOLVED: To manufacture a semiconductor device having high connection reliability at flip-chip connections at a high yield in a simplified process. SOLUTION: The manufacturing method comprises adhering a cap-like cover plate 2 having a recess 2a at the central inside surface to the back side of a semiconductor chip 1, forming bumps 4b on connection pads of a wiring board 5, forming a fluidic resin layer 6 on the bump-forming surface of the board, mounting with facedown the semiconductor chip 1 having the adhered cover plate 2 on the surface of the board 5 which has the formed resin layer 6, contacting bumps 4a of the chip to the bumps 4b of the board with the cover plate 2 abutted on the board 5, heating and melting the respective bumps on the chip and those on the board to bond them, and cross linking and hardening the resin layer 6 on the board 5, thus controlling the gap between the chip 1 and the board 5, i.e., the connection height of the bumps 4 to a prescribed value.</p> |
