| 摘要 |
PROBLEM TO BE SOLVED: To enhance performance of back-transfer prevention of a sealing resin only by an etching means by forming through holes at a plurality of thin metal blank plates by etching, simultaneously forming annular spot-facing part surrounding through an annular through hole edge at the blank plate of a lowermost stage, and laminating the plates of the respective stages. SOLUTION: A stencil body 1 comprises relatively thin two upper and lower blank plates 1a, 1b. A first through hole 2a corresponding to an upper half of a through hole 2 is formed from both upper and lower surface sides of the plate 1a by an etching means. A first through hole 2b corresponding to a lower half of the hole 2 and an annular recess 4a are similarly simultaneously formed at the plate 1b, and an annular through hole edge 3 is formed. A depth of the recess 4 is set substantially 1/2 of a height of the hole 2b. The plates 1a, 1b are laminated by an adhesive layer in the state that upper and lower holes 2a, 2b are aligned with each other. Thus, a relatively thin stencil is obtained, and since the plates 1a, 1b are thin, its finishing accuracy becomes good.
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