| 摘要 |
PROBLEM TO BE SOLVED: To manufacture a semiconductor package in a short time without complicating the manufacturing process. SOLUTION: The semiconductor package 100 comprises a semiconductor chip 101, a conductive wire 108 standing on the electrode pad 107 of the semiconductor chip 101, and an insulating film 110 covering the surface of the semiconductor chip 101 except the spherical tail part of the conductive wire 108 serving as a take-out electrode 109. The take-out electrode can be formed only through a wire bonding process for standing the conductive wire 108 on the electrode pad 107, and a step for forming the insulating film 110 covering the surface of the semiconductor chip 101 while exposing the tail part of the conductive wire 108. Consequently, manufacturing process is reduced and a semiconductor package can be manufactured in a short time using only a general purpose facility. |
