| 摘要 |
PROBLEM TO BE SOLVED: To eliminate a process of inserting resin into a space between a wiring board and the surface of a semiconductor chip, etc. SOLUTION: On the surface 21 of a semiconductor chip 2, a plurality of bumps B and an airtight wall section 22 are formed. The airtight wall section 22 is formed like a wall nearly in the same height as the bumps over the entire periphery of the surface 21. When mounting the semiconductor chip 2 on a wiring board 1, the work is performed in a gas atmosphere such as a nitrogen gas atmosphere, argon gas atmosphere, etc. As a result, the airtight wall section 22 can be tightly adhered to a plate-like body 11, and a space 30 between the wiring board 1 and the semiconductor chip 2 is insulated from the outer space, being filled with inactive gas. |
