发明名称 SEMICONDUCTOR DEVICE
摘要 PROBLEM TO BE SOLVED: To reinforce a contact strength between a bump and an inner lead by forming the lead provided at a support in a non-flat shape for reinforcing the contact with the bump. SOLUTION: Ends of inner leads 16 are formed in a non-flat shape for reinforcing a contact with a bump 18. The non-flat shape is realized, for example, by a hole or a recess, the ends of the leads 16 each has a split shape and a recess at its center. In this case, it is preferable to provide the relations of D>=L>=3/4D, W>=D, wherein W is a width of the lead 16, S is an interval between inside surfaces of the two branches 16b, L is a length of the branch 16b, D is a diameter of a large-diameter part 18a of a first stage of the bump 18, and d is a diameter of the part 18a of a second stage. Even when pitch narrowing is proceeded, reliability of a connector of the bump to the lead is executed.
申请公布号 JP2000252378(A) 申请公布日期 2000.09.14
申请号 JP19990050714 申请日期 1999.02.26
申请人 FUJITSU LTD 发明人 SAITO NOBUKATSU
分类号 H01L23/12;(IPC1-7):H01L23/12 主分类号 H01L23/12
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