PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD THERE OF
摘要
<p>PURPOSE: A printed circuit board and a manufacturing method thereof are provided to control a coating thickness deviation of a solder resist by including a first solder resist layer with low viscosity and a second solder resist layer with high viscosity. CONSTITUTION: A first solder resist layer is coated on one side of a substrate with a circuit pattern(S110). The first solder resist layer is temporarily hardened(S120). A second solder resist layer is laminated on the first solder resist layer(S130). The first solder resist layer is planarized by applying pressure to the second solder resist layer(S140). A solder resist pattern is formed(S150). The solder resist pattern is post-hardened(S160).</p>
