| 摘要 |
PROBLEM TO BE SOLVED: To simplify the structure while avoiding the thermal influence of a lead wire by arranging a large number of temperature sensors, a plurality of conductive lines to be connected therewith, and external connection terminals tightly on a substrate. SOLUTION: The sensor S for measuring the surface temperature of a substrate, i.e., a silicon wafer, comprises temperature sensors 2, conductive lines 3, and terminals 4 at the end of the lines arranged tightly on a substrate. 1. The temperature sensor 2 is a temperature measuring resistor formed by screen printing platinum paste whereas the conductive lines 3 and terminals 4 are formed by printing and firing silver palladium. Three or four conductive lines 3 are arranged in parallel for each temperature sensor 2 and the terminals 4 are collected at joints 5 formed in the outer circumferential region of the substrate 1. Since respective element are integrated with the substrate, then can be handled easily and since transfer of heat from the conductive lines 3 is insignificant, sensor characteristics are not damaged. Alternatively, the temperature sensor can be constituted as a thermocouple.
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