| 摘要 |
PROBLEM TO BE SOLVED: To commercialize a chip-on-chip structure wherein a plurality of semiconductor chips are stacked and jointed so that the surfaces face each other. SOLUTION: A positioning small hole 28 penetrating from a front surface 21 to a rear surface 23 is formed on a daughter chip 2. The positioning small hole 28 is so formed as to establish a specified positional relation ship with an electrode formed on the surface 21. The positioning small hole 28 is formed with a very small drill, water drill using a high water pressure, laser ray, and etching, etc. The positioning small hole 28 has a specified positional relation ship with an electrode 23. So, when the daughter chip 2 is stacked facedown on the surface 11 of a mother chip 1, the mother chip 1 is aligned with the daughter chip 2 with the positional small hole 28 which is confirmed from the rear surface 24 of the daughter chip 2 as a reference. |
