| 摘要 |
PROBLEM TO BE SOLVED: To provide a printed wiring board having the superior contact between a conductive layer which includes a conductor circuit and a via hole and a resin-insulating layer and is capable of preventing the delay of propagation of a signal in a high-frequency band, and a method of manufacturing it. SOLUTION: A printed wiring board includes conductor circuits 4, 5 formed on a board 1 and resin-insulating layers 2a, 2b covering the conductive circuits 4, 5, wherein an organic compound layer is formed on at least a part of the surface of the conductor circuits 4, 5. A method of manufacturing such a printed wiring board includes the steps of immersing a board 1 on which conductor circuits 4, 5 are formed into an aqueous solution of an organic compound or an organic solvent solution, applying a prescribed voltage across the positive electrodes of the conductor circuits 4, 5 and a negative electrode to form a deposited layer of the organic compound on the surface of the conductor circuits, and forming resin-insulating layers 2a, 2b which cover the conductor circuits 4, 5. |
