摘要 |
PROBLEM TO BE SOLVED: To obtain a manufacturing method and equipment which impose no restrictions on the arrangement of through-holes and requiring no alignment in printing, in the manufacture of printed flexible wiring boards wherein electrical wires formed on both surfaces of an insulating film are connected to each other via the through-holes. SOLUTION: A porous adsorbing sheet 23 and a porous plate 22, made from a porous material, are arranged on the lower surface of a printed flexible wiring board 25 having through-holes 24 formed therein. Furthermore, the resulting board 25 is placed on a printing table 21 with a space 21A interposed between the entire region on the lower surface side of the plate 22 and the table 21. While keeping the entire region on the lower surface side of the plate 22 under a uniformly pressure-reduced condition by sucking the board 25 downward via through-holes 21B arranged in the table 21, a conductive paste 31 is printed into the holes 24 from the upper surface of the board 25. As a result, a manufacturing method and equipment for printed flexible wiring boards, free of restrictions on the arrangement of the through-holes 24 are realized.
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