发明名称 Method for producing electrically conductive connections between two or more conductor structures
摘要 A method for producing at least one electrically conductive connection between two or more conductor structures in which at least one of the conductor structures is connected to a carrier to form a composite conductor system. At least one of the composite conductor systems has perforations in the region of contact points of the conductor structure. The connection is made in the region of the perforations by supplying thermal energy or by introducing an electrically conductive mass. Electrically conductive connections can be made between a plurality of conductor structures in a simple and cost-effective way which avoids damage to even thermosensitive thermoplastic carriers.
申请公布号 US6112406(A) 申请公布日期 2000.09.05
申请号 US19980188047 申请日期 1998.11.06
申请人 SIEMENS AKTIENGESELLSCHAFT 发明人 MUNDIGL, JOSEF
分类号 H05K3/34;(IPC1-7):H05K3/30 主分类号 H05K3/34
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