发明名称 METHOD AND DEVICE FOR SPUTTERING
摘要 PROBLEM TO BE SOLVED: To provide a sputtering method and device in which the control of the magnetic field is needless, and uneven sputtering is herd to occur in a target. SOLUTION: In a sputtering method in which plural sets of magnet assembled bodies 8 provided with plural magnets are parallelly provided at the back of a magnetron sputtering cathode 6, and a film is formed on a substrate 4 by magnetron discharge generated in front of a target 5, the magnets in each magnet assembled body are arranged in such a manner that the surrounding direction of drift electrons restrained by the magnetic field of each magnet assembled body and annularly drifting in front of the target is made the same one in all the magnet assembled bodies. The magnetic poles facing to the target sides in the magnets composing each magnet assembled body are mutually made different, also, the magnets with the same magnetic poles are adjacently arranged between the adjacent magnet assembed bodies, and an annular orbit in which the electrons restrained by respective magnetic fields and made independent drift is formed in each magnet assembled body.
申请公布号 JP2000239841(A) 申请公布日期 2000.09.05
申请号 JP19990046509 申请日期 1999.02.24
申请人 ULVAC JAPAN LTD 发明人 SUESHIRO SEISUKE;SATO SHIGEMITSU;OZORA HIROKI
分类号 C03C17/00;C23C14/34;C23C14/35;(IPC1-7):C23C14/35 主分类号 C03C17/00
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