| 摘要 |
<p>PROBLEM TO BE SOLVED: To realize a holding method of a sensitive substrate which can prevent deterioration of exposure accuracy which is caused by a leakage current from an electrostatic chuck to the sensitive substrate. SOLUTION: This holding method is a method which holds a wafer 15 on an electrostatic chuck 16 of an aligner. Power supply to the electrostatic chuck 16 is controlled in accordance with the 'ON and OFF' timings of exposure beam irradiation to the wafer 15. Power supply to the electrostatic chuck 16 is either not performed or restrained, when the wafer 15 is irradiated with the exposure beam, so that leakage current flowing into the wafer 15 is reduced. Thereby influence of the leakage current upon the exposure beam can be reduced.</p> |
