发明名称 SUBSTRATE HEATING METHOD AND SUBSTRATE HEATING DEVICE
摘要 PROBLEM TO BE SOLVED: To make treatment quality of heat treatment of a substrate uniform by preliminarily heating a pilot substrate prepared independently of a substrate for lot treatment during standby time before lot treatment. SOLUTION: When a precedent lot treatment is finished, a lot treatment ending signal is inputted. A pilot substrate for exclusive use to preliminary heating which is independent of a lot treatment substrate is positioned, carried to a heating chamber, and preliminary heating is started. When a lot start signal is inputted, a first treatment substrate is carried to the heating chamber after positioning, and there heat-treated instead of the pilot substrate during preliminary heating. Thereby the temperature distribution of a member facing the substrate in the heating chamber is maintained during standby time, and treatment quality of the lot treatment can be made uniform.
申请公布号 JP2000232108(A) 申请公布日期 2000.08.22
申请号 JP19990034296 申请日期 1999.02.12
申请人 DAINIPPON SCREEN MFG CO LTD 发明人 NISHIHARA HIDEO
分类号 H01L21/205;H01L21/324;(IPC1-7):H01L21/324 主分类号 H01L21/205
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