发明名称 |
SEMICONDUCTOR PACKAGE WITH LOW STRAIN SEAL |
摘要 |
A semi-conductor packaging structure and a method to reduce the seal strain of the package are disclosed. The structure comprises a cap, substrate, seal and the cap and substrate have a predetermined TCE mismatch. The TCE mismatch between the cap and substrate is predetermined to minimize the seal strain during power-on and power-off use conditions. Preferably, the device has a substrate comprises a ceramic material, a cap with a thermal conductivity of at least about 100 W/m-K. A method of selecting a cap material is disclosed. |
申请公布号 |
KR100264101(B1) |
申请公布日期 |
2000.08.16 |
申请号 |
KR19960028480 |
申请日期 |
1996.07.15 |
申请人 |
INTERNATIONAL BUSINESS MACHINES CORPORATION |
发明人 |
PATRICK, ANTHONY COICO;DAVID, LINN EDWARDS;SHAJI, FAROOQ;READ A. SHERIF;HILTON T. TOY |
分类号 |
H01L23/02;H01L23/04;H01L23/06;H01L23/08;H01L23/10;(IPC1-7):H01L23/04 |
主分类号 |
H01L23/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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