| 摘要 |
PROBLEM TO BE SOLVED: To improve reliability of a semiconductor device by preventing operation failures due to peeling, crack, etc., within the semiconductor device. SOLUTION: This semiconductor device 10 is constituted such that a plurality of bumps 2, 4 are formed on top of each other on an external terminal 11 of a semiconductor chip 1, a plurality of resin layers 3, 5 are laminated on the surface of the semiconductor chip 1 so as to cover the periphery of the bumps 2, 4, and at least two layers of the resin layers 3, 5 contain at least one bump 2, 4. There are also provided an electronic module 40 and electronic element 51 connected to this semiconductor device 10 via a bonding material on the motherboard. There is also provided an electronic equipment 50 on which this electronic element 51 is mounted. The semiconductor device 10 is fabricated by a method comprising steps of bonding at least one or more bumps 2 on the external terminal 11 of the semiconductor chip 1 to provide electrical conductivity, coating a first resin layer 3 in the periphery of the bump 2 and curing it, bonding at least one or more bumps 4 on the bump 2 in the first resin layer 3 and coating a second resin layer 5 in the periphery of the bump 4 and curing it. |
