| 摘要 |
PROBLEM TO BE SOLVED: To prevent thoroughly the dust or the like contained in treating gas supplied into a pressure vessel or brought about from inside the pressure vessel or interior equipment, such as a heater, or the like from sticking to a workpiece, in pressurizing treatment of a semiconductor wafer conducted by using a vertical type pressure vessel having the heater and others fitted internally, since the sticking of such dust to the workpiece causes a fatal defect in the quality of the semiconductor obtained after the treatment. SOLUTION: An inner vessel 16 so designed that it can surround airtightly the part of installation of a workpiece W is provided inside a pressure vessel 4. This inner vessel 16 is provided with a gas introducing part 18 at the lower position thereof where this part can be made free of a high-temperature atmosphere from heaters 11 and 12. The gas introducing part 18 is provided with a filter 20. Besides, the inner vessel 16 is provided with a check valve 19 sharing a unidirectional gas flow directed outward from inside this vessel.
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