发明名称 Method of producing a sensor subassembly, and sensor subassembly
摘要 A sensor subassembly contains a base part that is formed of plastic and has a sensor holding region with sensor connections provided therein and a connection region with plug connections provided therein. A sensor element with electrical contacts is electrically conductively connected to the sensor connections. Fastened to the base part is a printed circuit board, via which an electrical connection between the sensor element and the plug connections is made.
申请公布号 US6098459(A) 申请公布日期 2000.08.08
申请号 US19990426419 申请日期 1999.10.25
申请人 SIEMENS AKTIENGESELLSCHAFT 发明人 BAUER, HANS-PETER
分类号 B60R16/02;B60R16/023;G01P1/02;H05K5/00;(IPC1-7):G01D11/24 主分类号 B60R16/02
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