发明名称 |
Method of producing a sensor subassembly, and sensor subassembly |
摘要 |
A sensor subassembly contains a base part that is formed of plastic and has a sensor holding region with sensor connections provided therein and a connection region with plug connections provided therein. A sensor element with electrical contacts is electrically conductively connected to the sensor connections. Fastened to the base part is a printed circuit board, via which an electrical connection between the sensor element and the plug connections is made.
|
申请公布号 |
US6098459(A) |
申请公布日期 |
2000.08.08 |
申请号 |
US19990426419 |
申请日期 |
1999.10.25 |
申请人 |
SIEMENS AKTIENGESELLSCHAFT |
发明人 |
BAUER, HANS-PETER |
分类号 |
B60R16/02;B60R16/023;G01P1/02;H05K5/00;(IPC1-7):G01D11/24 |
主分类号 |
B60R16/02 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|