| 摘要 |
PURPOSE: A solderless wireless socket type circuit by compressing a stack conductive line panel is provided to alternate a solderless bread board and printed circuit board, and remove a soldering process, and reduce an embodiment time. CONSTITUTION: A circuit pattern panel(1) displaying information about a device position, a device direction, and a circuit line is provided. A device socket combined a soft panel to a socket strip(9) and a socket type panel(2) which a circuit and a substrate are one body are positioned on the under of the circuit pattern panel with a lattice arrangement having a constant spacing. A line pattern is drown by a conductive ink or tape, but divided into several line panels so that a line is not crossed and drown. A hole(6) is formed at a contact point of the soft panel so that the contact point drown on the soft line panel is contacted to the pin of the socket type panel, thereby, positioning a stacked conductive line panel(3a,3b,3c) consisted of several layers on the under of the circuit pattern panel. A compressing panel(4a,4b) consisted of an elastic panel(3a) and a hard panel(3b) is positioned on the under of the circuit pattern panel. A compressing structure able to compress the panels is provided. |
