| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device and its manufacturing method with which the control performance of resistance value can be enhanced. SOLUTION: This semiconductor device is provided with at least, two conductive layers R1 and R2, which are adjacent to each other and an insulating film 2 covering the conductive layers R1 and R2. The insulating film 2 is provided with openings Op1 and Op2 partly exposing the respective conductive layers R1 and R2. A shortest distance D2 between the closest parts of the conductive layers R1 and R2 is set larger than a shortest distance D1 between the conductive layers. Therefore, even if a part of the conductive layer R1 is cut out, the possibility of adhesion of its scattering matter Q, etc., to the adjacent conductive layer R2 can be reduced.
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