METHOD TO CONTROL CAVITY DIMENSIONS OF FIRED MULTILAYER CIRCUIT BOARDS ON A SUPPORT

摘要

PURPOSE: A method of improving the dimensional control and deformation control during lamination and firing of multilayer, patterned green tape stacks is provided. CONSTITUTION: A method of forming a multilayer printed circuit board bonded to a metal support substrate and having a cavity punched therein, comprises a) applying a composition of a screen printable composition comprising a glass/ceramic powder selected from the group consisting of a glass, a ceramic and mixtures thereof and an organic vehicle to the to top layer of a green tape stack the glass/ceramic powder having a firing temperature at least as high as the glass of the green tape; b) laminating the green tape stack; c) punching a cavity through the laminated green tape stack; and d) laminating the stack obtained in step c) to a metal support substrate having bonding glass thereon; and e) firing above the sintering temperature of the glass of the green tape.