| 摘要 |
A thermal infrared detector comprising a dielectric pellicle (5) suspended over a cavity in a substrate (6), the pellicle supporting a detector element (1) comprising a heat sensitive semiconductor layer (3) between a pair of thin film metallic contacts (2, 4), these being deposited on the pellicle, the cavity being formed by etching and removal of the substrate material through holes or slots (8) in the surface of the substrate.
|
