发明名称 APPARATUS FOR MONITORING UNLOADING FOR WIRE BONDING
摘要 PURPOSE: An unloading monitoring apparatus is provided to improve a yield and a quality of a lead frame by monitoring a height of a lead frame so that a wire-bonded lead frame is exactly loaded on an unloading magazine. CONSTITUTION: An unloading monitoring apparatus comprises a sensing part(10) which senses a height of a lead frame. A signal amplifier(20) amplifies a sense signal from the sensing part, and an analog-to-digital converter(30) converts a signal from the signal amplifier(20) into a digital signal. A synchronous signal generator(40) generates a synchronous signal for synchronizing an operation of the converter(30). A difference sensing part(50) calculates a distance from a reference surface of the lead frame to a declination surface, from the digital signal of the converter(30). A declination judging part(60) compares the calculated distance with an allowable error to calculate an error value. An error signal generator(70) generates an error message when the distance is more than the allowable error, and a central control part(80) responds to the error message to control an index motor driving part(90).
申请公布号 KR20000044556(A) 申请公布日期 2000.07.15
申请号 KR19980061055 申请日期 1998.12.30
申请人 HYUNDAI ELECTRONICS IND. CO., LTD. 发明人 PARK, SEUNG WOON;PARK, BEOM WOOK;CHOI, IM CHEOL
分类号 H01L21/60;(IPC1-7):H01L21/60 主分类号 H01L21/60
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