PARTS MOUNTING METHOD AND APPARATUS

摘要

According to the present invention, a control device (130, 402) and a circuit board moving device (140, 341) controlled in operation by the control device for holding a circuit board are provided, whereby the circuit board moving device is moved to bring a component mount position on the circuit board (2) closest to a recognition device (120, 121, 371, 372) after the circuit board moving device is moved to bring the component mount position closest to a component feed position. In the state, a circuit board mark formed on the circuit board is detected, thereby recognizing a position of the circuit board. A transfer distance for the component by a component hold device (107, 321) from the recognition device to the component mount position is thus shortened, enabling high-speed mounting with higher accuracy.