发明名称 WAFER PROCESSING EQUIPMENT
摘要 PROBLEM TO BE SOLVED: To continue wafer processing, even when waste solution recovering facilities or cooling facilities malfunction etc., and to prevent increase of the dimensions and cost of the equipment as well. SOLUTION: A processing solution is stored in a processing bath 12, and wafers are processed by dipping the wafers in this processing solution. The processing bath 12 is provided with a drain passage for the processing solution composed of discharging pipes 20, 22, a joining discharging pipe 24, an drain pipe 30, a connecting pipe 50, a first drain pipe 52, etc., and this passage is connected to waste solution recovering facilities 56. Besides, a second drain pipe 58 is branched from the connecting pipe 50, and connected to the inlet 68 of the aspirator 62. Furthermore, the first and second drain pipes 52, 58 are provided with closing valves 54, 60 respectively. Usually, the closing valve 54 is open, and the closing valve 60 is closed. If the waste solution recovering facilities 56 malfunction, the closing valve 54 is closed, and the closing valve 60 is opened.
申请公布号 JP2000173973(A) 申请公布日期 2000.06.23
申请号 JP19980343748 申请日期 1998.12.03
申请人 DAINIPPON SCREEN MFG CO LTD 发明人 ARAI KENICHIRO;NAGARA SHUJI;AMAHISA KENJI
分类号 H01L21/304;(IPC1-7):H01L21/304 主分类号 H01L21/304
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