| 摘要 |
PROBLEM TO BE SOLVED: To provide a small-sized economical reflow device, in which the temperature profile in a solder connection part can be freely controlled. SOLUTION: A reflow device 10 is provided with a heat source 16, provided in an supporting arm 14 and a lift 18 for lifting the heat source. The device has a control part 20 for controlling the operation of the lift and the heat source, is accordance with the prescribed temperature profile at a lower portion. Halogen lamps emitting soft beams are used for the heat sources. They are arranged on the support arm so as to form a staggered arrangement, and they cover a mounting board sent and a board-carrying rail as a whole. An air actuator is used for the lift. A rod 34 expands or contracts by sending/ exhausting air into a cylinder 32. Thereby, the halogen lamps are lifted via the vertical lifting and descent of a main arm and the support arm. According to the lifting and descent of the halogen lamps, the solder connection part on the mounting board is brought into/out of the secondary focus of the halogen lamps.
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