发明名称 SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
摘要 PURPOSE: A semiconductor device and a method for manufacturing the same are provided to minimize leakage current by increasing a length of circumference of isolation. CONSTITUTION: A semiconductor device comprises a semiconductor substrate(21), an isolation layer(28a), a gate electrode(29), and a source/drain region. The isolation layer(28a) has a trapezoid shape. The isolation layer(28a) is formed within a trench. The gate electrode(29) is formed on an active region of the semiconductor substrate(21). The source/drain region is formed on the substrate(21) of both sides of the gate electrode(29). The isolation layer(28a) comprises an insulating layer for isolating devices and a sidewall formed at both sides of the insulating layer.
申请公布号 KR100259083(B1) 申请公布日期 2000.06.15
申请号 KR19970061153 申请日期 1997.11.19
申请人 HYUNDAI MICRO ELECTRONICS CO., LTD. 发明人 SHIM, PIL-BO
分类号 H01L27/04;(IPC1-7):H01L27/04 主分类号 H01L27/04
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