发明名称 CURABLE RESIN COMPOSITION, ADHESIVE COMPOSITION, BONDED ARTICLE, SPEAKER, AND ADHESION METHOD
摘要 PROBLEM TO BE SOLVED: To provide a curable resin composition which is excellent in adhesion to aramid fibers by compounding a polymerizable vinyl monomer, a polymerization initiator, an aromatic amine and/or a pyridine derivative, aβ-diketone chelate and/or aβ-keto ester, and a phosphate. SOLUTION: The polymerizable vinyl monomer (A) is preferably a (meth) acrylic monomer. The polymerization initiator (B) is preferably an organic peroxide. The aromatic amine and/or the pyridine derivative (C) is preferably an aromatic amine, N,N-dimethylaniline being still preferable. Theβ-diketone chelate and/or theβ-keto ester (D) is preferably aβ-diketone chelate, vanadyl acetyl acetonate being the most preferable. Preferably, the phosphate (E) is acidophosphooxyethyl methacrylate. Preferably, the composition comprises 100 pts.wt. ingredient A, 0.5-10 pts.wt. ingredient B, 0.05-5 pts.wt. ingredient C, 0.05-5 pts.wt. ingredient D, and 0.05-10 pts.wt. ingredient E.
申请公布号 JP2000159835(A) 申请公布日期 2000.06.13
申请号 JP19980348625 申请日期 1998.12.08
申请人 DENKI KAGAKU KOGYO KK 发明人 SUDO HIROSHI;TAGUCHI KOICHI
分类号 H04R31/00;C08F20/10;C08F30/02;C08F290/06;C09J4/02;C09J5/00;C09J171/00;H04R7/02;(IPC1-7):C08F20/10 主分类号 H04R31/00
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