发明名称 Semiconductor device and process for fabricating the same
摘要 After a pattern is transferred on silicon film crystallized by annealing, the silicon film is annealed by radiation of intense rays for a short time. Especially, in the crystallizing process by annealing, an element which promotes crystallization such as nickel is doped therein. The area not crystallized by annealing is also crystallized by radiation of intense rays and a condensed silicon film is formed. After a metal element which promotes crystallization is doped, annealing by light for a short time is performed by radiating intense rays onto the silicon film crystallized by annealing in an atmosphere containing halide. After the surface of the silicon film is oxidized by heating or by radiating intense rays in a halogenated atmosphere and an oxide film is formed on the silicon film, the oxide film is then etched. As a result, nickel in the silicon film is removed.
申请公布号 US6071764(A) 申请公布日期 2000.06.06
申请号 US19950496085 申请日期 1995.06.28
申请人 SEMICONDUCTOR ENERGY LABORATORY CO., LTD. 发明人 ZHANG, HONGYONG;OHNUMA, HIDETO;TAKEMURA, YASUHIKO
分类号 H01L21/20;H01L21/322;H01L21/336;H01L21/77;H01L21/84;(IPC1-7):H01L21/84 主分类号 H01L21/20
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