| 摘要 |
PROBLEM TO BE SOLVED: To work an upper wiring layer with ease by providing a planarization insulating layer over a lower wiring layer to absorb unevenness. SOLUTION: A first insulating layer 2 is formed on a base board 1, a first earthing layer 3 is formed on the first insulating layer 2, and a second insulating layer 4 is formed on the first earthing layer 3. A first wiring layer 5 is formed on the second insulating layer 4 so as to contain a wiring of long wiring length, a third insulating layer 6 is formed on the second insulating layer 4 and the first wiring layer 5, a second earthing layer 7 is formed on the third insulating layer 6, and a planarization insulating layer 8 is formed on the second earthing layer 7. Further, a third earthing layer 10 is formed on the planarization insulating layer 8, a fourth insulating layer 11 is formed on the third earthing layer 10, and a second wiring layer 12 is formed on the fourth insulating layer 11 so as to contain a wiring which is narrower than the wiring of the first wiring layer 5 in wiring width and shorter than it in wiring length. A fifth insulating layer 13 is formed on the fourth insulating layer 11 and the second wiring layer 12, and a fourth earthing layer 14 is formed on the fifth insulating layer 13. |
