| 摘要 |
PROBLEM TO BE SOLVED: To improve flattening characteristics and productivity of a spin-on- glass film. SOLUTION: A wafer 120 is fixed to a water support stage 110, attached inside an internal vessel 10A on which an internal lid 10B is provided so that the wafer 120 is positioned in a sealed space. The internal vessel 10A is positioned in a external vessel 20A, on which an external lid 20B is provided so that an external vessel 20A and an external lid 20B surround the internal vessel 10A and internal lid 10B. A spin-on-glass film is applied on the wafer 120, and a spin-on-glass solvent is jetted in a sealed vessel containing the wafer 120 for the vapor of solvent to be saturated in the vessel, and the wafer 120 is so rotated that the spin-on-glass film redissolves for flattened the surface of the spin-on-glass film.
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