METHOD AND DEVICE FOR TREATING SUBSTRATE

摘要

PROBLEM TO BE SOLVED: To supply a treating liquid uniformly on the whole surface of a substrate without making any impact on the substrate. SOLUTION: When a treating liquid discharge nozzle 6 is positioned at a movement starting position P1 located out of a substrate W held by a spin chuck 1, discharge of a wettability improving liquid WQ from a discharge port 20B is started. When the treating liquid discharge nozzle 6 starts moving towards the substrate W and reaches a position P2, the discharge of the wettability improving liquid is stopped and discharge of a developer Q from a discharge port 20A is started. After the end surface 6a of the treating liquid supply nozzle is made wet by the developer Q discharged from the discharge port 20A, the treating liquid supply nozzle 6 is over the substrate W from one end side WS of the substrate W held by the spin chuck in a stationary state to the other end side WE while the developer Q is being discharged from the treating liquid supply nozzle 6 so that the developer Q is supplied on the substrate W.